Copper Injection Molding (CuMIM®) is an advanced technology predominantly used for high-volume manufacturing of complex heatsinks. By leveraging copper’s exceptional thermal and electrical conductivity, this process enables the production of intricate shapes, particularly useful in the electronics and automotive industries.
In electronics, CuMIM® heat sinks are crucial for maintaining device performance by effectively dissipating heat. Similarly, copper’s superior heat dissipation properties in the automotive sector contribute to efficient system operation.
The Copper Injection Molding (CuMIM®) process is ideal for industries requiring high-performance copper components with complex geometries that are difficult to manufacture using traditional methods. Copper is a highly conductive material making it ideal for applications requiring efficient energy transfer.
In tungsten-copper (WCu) composites, the tungsten-to-copper ratio can be tailored to meet specific application requirements. These alloys are available in various compositions, such as 90W10Cu, 85W15Cu, 80W20Cu, 70W30Cu, 60W40Cu, and 50W50Cu, each offering distinct performance advantages. Higher tungsten content enhances heat resistance, wear durability, and reduces thermal expansion. In contrast, increased copper content improves electrical and thermal conductivity but results in greater thermal expansion.
Tungsten-Copper Injection Molding finds its applications in various industries due to the distinctive properties of its constituent elements. In comparison, pure copper is renowned for its exceptional thermal and electrical conductivity, it has higher Coefficient of Thermal Expansion (CTE) which pose challenges in compact systems where minimizing thermal expansion is essential.
AMT has registered CuMIM® for the application of pure copper using the MIM technology. Utilizing the MIM technology capability allows engineers to design unconventional copper heat sink for power electronics, optoelectronics and automotive applications.
With pure copper material, these CuMIM® components have thermal conductivity of 320 W/mK. These copper parts can be designed with complex geometry so that the electronic component can be mounted on the copper part, and at the same time, be used for heat dissipation. Till date, AMT had delivered more than 5 million copper parts globally for use in this application in the industry.
We use cookies to give you the best online experience. By agreeing you accept the use of cookies in accordance with our cookie policy.