Optimizing Thermal Management in Power Electronics with CuMIM®
One of the most innovative applications of Copper Injection Molding is in the development of liquid-cooled cold plates for power electronics thermal management. Cold plates, made from high thermal conductivity materials like copper, are engineered to efficiently transfer heat away from power modules, IGBTs, and MOSFETs.
Manufacturing Precision LiDAR Components and Co-Packaged Optics: Solutions for Industry Leaders
Advanced Copper Injection Molding (CuMIM®) technology for complex geometries and high thermal conductivity.
Copper Injection Molding CuMIM®: Revolutionizing Thermal Solutions in Electronics
Copper injection molding revolutionizes thermal management, offering superior heat dissipation in compact, complex designs. This technique enables cost-effective production of high-performance cooling solutions
