The Growing Need for Advanced Thermal Management in Power Electronics
Challenges of Heat Dissipation in High-Power Electronics
With rapid advancements in electric vehicles (EVs), renewable energy systems, and data center power infrastructure, power electronics are experiencing an unprecedented surge in power density. As the backbone of modern energy and computing systems, power electronics require efficient thermal management solutions to prevent overheating and enhance performance.
According to the IDTechEx research report on Thermal Management for Power Electronics 2025-2035, two-phase immersion cooling is emerging as a highly efficient solution for managing heat in these high-power environments. This technology utilizes a dielectric fluid that absorbs heat and undergoes a phase change (liquid to vapor), eliminating the need for traditional heatsinks and fans. This innovation reduces energy consumption by 40-50%, making it ideal for AI-driven power systems, renewable energy inverters, and EV power modules. However, two-phase immersion cooling presents unique challenges, requiring advanced fluid dynamics and efficient cooling components for optimal heat dissipation.
Advanced Copper Injection Molding (CuMIM®) with MPIF-35 Standards
Introduction to CuMIM® Technology
AMT’s Copper Injection Molding (CuMIM®) technology is a cutting-edge solution designed to manufacture high-performance cooling components for power electronics. This process adheres to the stringent MPIF-35 standards, providing a benchmark for reliability and quality in powdered metal manufacturing. Established by the Metal Powder Industries Federation (MPIF), these standards ensure high precision, consistency, and durability in thermal management applications.
Advantages of CuMIM® in Thermal Management
Challenges of Heat Dissipation in High-Power Electronics
One of the most innovative applications of CuMIM® is in the development of liquid-cooled cold plates for power electronics thermal management. Cold plates, made from high thermal conductivity materials like copper, are engineered to efficiently transfer heat away from power modules, IGBTs, and MOSFETs.
Traditional cold plate manufacturing required welding two separate plates, posing a risk of liquid leakage. However, with In-Coring® technology, CuMIM® enables engineers to integrate complex internal cooling channels directly into a single copper plate. This advancement eliminates leakage risks while significantly enhancing cooling efficiency and component reliability. The heat is rapidly transferred to a cooling fluid, which then dissipates it through a radiator or heat exchanger.
Why Choose CuMIM® for Thermal Management?
The unique advantages of Copper Injection Molding (CuMIM®) make it a superior choice for businesses seeking advanced thermal management solutions:
- Superior Thermal Conductivity: Copper is one of the best materials for heat dissipation, outperforming other metals like aluminum.
- Design Flexibility: CuMIM® allows the creation of intricate geometries and custom cooling solutions tailored to specific requirements.
- Scalability: The CuMIM® process is well-suited for mass production, making it a cost-effective solution for large-scale applications.
- Durability and Reliability: By adhering to MPIF-35 standards, our CuMIM® ensures consistent quality and performance.
Applications of CuMIM® in Power Electronics
CuMIM® is ideal for electronic systems and devices where efficient cooling is essential, including power electronics, high-performance computing systems, laser diode cooling, and optical module applications.
